Fabrication of metallic microstructures at the Cleanroom facilities of Los Andes University allows researchers to get involved in the fields of microelectronics and microsystems. Different techniques for the fabrication of metallic microstructures of cooper and aluminum on glass and silicon substrates have been implemented. Those techniques were used in the fabrication of passive microelectronics devices. The implemented techniques at the Clean room using mask-free photolithography and selective material chemical etching are described in this document. Fabrication techniques reached resolutions of 5 µm. Those processes were tested for thin metal deposition layers of copper and aluminum with thickness from 50 to 200 nm.