The semiconductor industry is highly dynamic and innovative. New semiconductor devices are introduced every year with improved performance and a smaller footprint. Efficient process control is essential for high yield operation. The fast dynamics of the semiconductor industry has to be matched with the innovation of metrology. Old methods do not meet today’s challenges. This talk describes the benefits of inductively coupled plasma (ICP) online analysis for process solutions for advanced packaging, and its ability to detect metal impurity concentrations. Ten years ago, ICP technology was very expensive, bulky, and unreliable. Over the years, it has matured and has become a common analytical tool in the lab. The next step is to bring this solution to point of use in the cleanroom for an automatic unattended operation. A unique feature of the ICP method is its ability to measure multiple elements at the same time. It also does not use an open flame which enables safe operation in compliance with semiconductor standards. The table below summarizes some of the typical applications: Chemistry Component Analyzable by ICP Acid Copper Electrodeposition Copper, Acid, Chloride, TOC, Trace Metals (Ni, Sn, Au), Accelerator Turnover Nickel Electrodeposition Nickel, Boric, Chloride/Bromide, TOC, Trace metals (Cu, Sn, Au) Sn, SnAg Electrodeposition Sn/Sn(IV), Ag/Bound Ag; Trace metals (Cu, Ni, Au) Sulfite Au Electrodeposition Au, Tl/As, SO4, Trace metals (Cu, Sn, Ni) Electroless Solutions Main components, stabilizers, Pd catalyst, Boron/Phosphorous reducers The presentation will describe challenges and solutions to enable effective online monitoring of different chemistry types with a single analyzer. Case studies will be used to demonstrate the effectiveness of metals removal and breakdown products with ICP metrology to achieve higher process control.