The combination of a commercial photosensitive resin with copper nanoadditives was the focus of this research, specimens were constructed by means of laser stereolithography 3D printing technique. The physicochemical characterization investigation considered the effect of different concentrations and types of copper nanoadditives, and, established the relationship between percentage of additive and material properties. Compound resulted by mixing the resin and copper nanoadditives could be used for novel technology micro-electric-mechanical systems due to the inclusion of copper as an electricity conductor. The additive-resin weight/weight concentrations used were 0.26%, 0.34% and a 0% additive as control. After mixing the material was cured by stereolithography, and the specimens were subject to indentation test and mechanical dynamic analysis for the sake of calculate its physicochemical characteristics and how the addition of copper affected them. The viscoelastic and plastic resistance results obtained with indentation tests showed that when the concentration of additives increased the viscoelastic resistance increased too but the plastic resistance didn't show any considerable change. The storage modulus and glass transition temperature results obtained with dynamic mechanical analysis demonstrate that when the concentration of additives increased, both, modulus and glass transition temperature tended to increase too. This research demonstrated the improvement of viscoelastic and physical-thermal properties of the resin when mixed with the copper nanoadditives in both shapes, particles and wires.