New two and three dimensional mini heat pipes are proposed for cooling electronic components in printed circuit boards in cabinets. These heat pipes can capture the heat from electronic components and conduct it to the cabinet wall, through the narrow spaces available between boards. As the location and dissipation of the electronic components vary, several different heat pipes are necessary for a complex electronic equipment. These heat pipes should operate at different temperatures and orientations. A hybrid wick structure, composed by sintered copper powder and wires along the device are proposed. Four different types of hybrid mini heat pipes, in up to three generations, were designed and constructed, using diffusion bonding fabrication technique. Two different testing setups were developed. In the first one, the thermal performance of the hybrid heat pipes was accessed, resulting in the selection of the appropriated working fluid and its volume. In the second setup, the devices were tested in a rig that mimic an actual electronic equipment geometry and its operational conditions. The several hybrid heat types worked well for the normal operation conditions. Some of them were able to transport heat even in very unfavorable circumstances. The work presented in this paper has many contributions for the state of the art, being the most important: the proposed 2D and 3D geometries, the new wick structure and the fabrication process used.