The change of temperature of an object introduces variation of the objects dimensions. These dimensional changes that are in the micrometer scale, can have undesired consequences as for example the decoupling of soldering points in electronic circuits. In this work we present a system based on digital interferometry to quantify the dimensional change induced on an electronic circuit board as it operates. In digital holographic interferometry of double exposure two holograms of the object are registered for different temperatures. The holograms are registered by a solid state detector and transferred to a computer; thereafter the recordings are reconstructed numerically using Fresnel's approximation. The amplitude and the phase of the complex optical field reflected by the object can be recovered. The resulting phase map is converted into micrometer dimensional variations by means of a lookup table generated previously. The lookup table is computed by calibrating phase maps obtained when known mechanical displacements are introduced over an object. We present experimental results of deformations in the range of 0, 5 μm to 4 μm for a regular circuit board.